NEPCON ASIA brings together a wide spectrum of electronics manufacturers from across Asia to showcase comprehensive and cutting-edge cross-industry production solutions. From PCBA to smart factory technologies, semiconductor packaging and testing to display innovations, and automobile manufacturing to more, the event aims to foster upstream and downstream business collaborations within the industry, ultimately boosting the global competitiveness of electronics manufacturers in Asia.

NEPCON ASIA 2023 introduces an innovative concept focused on "PCBA & IC Packaging", featuring 1,200 exhibitors and brands unveiling new domestic and international equipment and advanced technological solutions in electronic components, PCBA processes, smart manufacturing, EMS services, and semiconductor packaging and testing. The exhibition will intersect with multiple concurrent events, opening doors to cross-border business opportunities spanning consumer electronics, home appliances, industrial control, communication, automotive, touch display, new energy, medical devices, optoelectronics, and more, injecting fresh vitality into Asia's electronics industry.

Moreover, over 30 cross-border events will run concurrently, covering topics such as PCBA processes, semiconductor packaging, industrial robotics, intelligent storage and logistics, machine vision, smart factory technologies, industrial Internet, laser applications, 3C products, household appliances, communications, automotive advancements, 5G, Internet of Things, artificial intelligence, AR/VR, new energy solutions, medical devices, lighting, and other trending areas. These events aim to create diverse opportunities for domestic and international business connections, serving as a comprehensive platform for fostering Asian cross-border business networks.

To ensure a streamlined experience, all attendees at this year's exhibition will undergo real-name registration and verification, utilizing personal ID cards to obtain admission badges onsite.